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On-Chip Optical Interconnect Market By Integration Architecture (Monolithic, Heterogeneous, and 3D-Stacked Photonics), By Photonic Platform (SiPh, InP, LNOI and Others), By Modulation Scheme (Direct-Detect, and Coherent), By Performance Tier (Standard, Mid and High), By Link Distance (Intra-Die and Inter-Die), By End-Use Application (SoCs for HPC/AI, Network-on-Chip, Memory Interfaces and Others) – Global On-Chip Optical Interconnect Analysis & Forecast, 2025–2030
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