Boschman Redefines Power Module Packaging Innovation

Industry Insights from Next Move Strategy Consulting

As the global drive toward electrification and energy efficiency accelerates, Boschman Technologies B.V.  a Netherlands-based pioneer in sintering equipment and transfer molding technology is shaping the future of automotive and industrial power module packaging. Founded in 1987, the company has evolved into a key enabler of high-reliability semiconductor packaging, merging decades of engineering precision with cutting-edge material science.

From electric vehicles to renewable energy systems and industrial power electronics, the demand for high-performance modules capable of withstanding thermal, electrical, and mechanical stress has never been higher. Boschman’s innovative packaging solutions, rooted in silver sintering and Film Assisted Molding (FAM), are addressing these challenges head-on delivering greater performance, reliability, and manufacturability across global markets.

Engineering Excellence in Advanced Packaging

Boschman’s rise as a leader in advanced packaging stems from its focus on two foundational technologies: pressurized silver sintering and Film Assisted Molding (FAM). Together, these processes redefine what’s possible in power module design, particularly for applications that operate under extreme temperature and power conditions.

Silver sintering, a process that replaces traditional soldering, delivers exceptional thermal and electrical conductivity a critical factor in EV inverters, industrial drives, and renewable power converters. By applying pressure during sintering, Boschman’s equipment ensures void-free, dense interconnect layers that can endure higher operational stresses while significantly reducing thermal resistance. This results in enhanced reliability, longer module lifespans, and superior power efficiency.

On the other hand, FAM technology introduces a breakthrough in protective encapsulation. Using vacuum-assisted films, the process eliminates voids during molding and provides robust sealing against harsh environmental factors such as high humidity, vibration, and mechanical stress. For industries that demand longevity and resilience from automotive to heavy industrial systems this represents a major step forward in packaging integrity.

“Power modules are the beating heart of modern electrification,” a Boschman representative emphasized. “Our technologies don’t just connect materials they connect performance, sustainability, and reliability into one unified system.”

A Strategic Response to Global Market Shifts

The power module market is witnessing significant expansion, particularly in Europe and China, where the twin forces of electrification and renewable energy integration are reshaping industry priorities. As manufacturers pivot toward sustainable, high-efficiency solutions, the need for advanced packaging that can handle rising power densities and thermal loads has become a defining competitive factor.

Boschman’s sintering and FAM platforms directly address this market evolution. Designed for automotive, industrial, and consumer electronics, these technologies enable high-temperature, high-power, and high-reliability interconnections essential for next-generation devices. Whether for EV powertrains, solar inverters, or high-efficiency industrial drives, Boschman’s packaging solutions ensure consistent performance under the most demanding conditions.

The company’s presence in the Netherlands, Singapore, and China (Suzhou) allows it to maintain global agility supporting localized manufacturing, customer co-development, and fast-track prototyping for a rapidly evolving semiconductor ecosystem.

From Mold Making to Advanced Equipment Solutions

Boschman’s journey began with module packaging molds, serving early semiconductor assembly needs. Over the decades, the company transitioned from tooling design to research and development in silver sintering packaging equipment, a move that positioned it at the forefront of high-reliability module production.

Today, Boschman delivers a complete suite of advanced high-pressure sintering equipment tailored to varying production scales. Its modular portfolio caters to diverse needs from R&D and small-batch production to pilot-scale and high-volume manufacturing enabling customers to seamlessly scale operations as demand grows.

Boschman’s client base spans the electronics assembly and semiconductor back-end packaging industries, where precision, throughput, and consistency are critical. By integrating automation, intelligent process control, and superior thermal management, Boschman ensures manufacturers can meet modern energy and performance standards without compromising on reliability.

Collaboration and Strategic Ecosystem Partnerships

Boschman’s long-standing relationships with Taiwanese industries underline its global engagement strategy. The company has established deep cooperation with power electronics and component manufacturing service vendors, providing tailored packaging solutions for power management and thermal performance.

A key segment of Boschman’s customer base includes OSAT (Outsourced Semiconductor Assembly and Test) companies critical players in semiconductor back-end operations. These clients, who deliver services for Tire Pressure Monitor Sensors (TPMS) and other automotive sensors, have found Boschman’s sintering and molding technologies vital for achieving enhanced durability and miniaturization in demanding automotive environments.

Further strengthening its value chain, Boschman collaborates closely with Powertrim Technologies, another Dutch firm exhibiting at the Netherlands Pavilion. Their partnership represents a synergistic upstream and downstream relationship, combining Boschman’s expertise in packaging equipment with Powertrim’s system-level integration capabilities. Together, they serve leading automotive and industrial clients across Europe, driving efficiency and innovation throughout the power module supply chain.

A Comprehensive Packaging Ecosystem

Beyond its technological offerings, Boschman’s business model emphasizes end-to-end support for customers across the automotive supply chain and power systems industries. This includes packaging design, process development, silver sintering equipment, design proofing, and small-batch assembly production.

By providing integrated solutions from prototype to production Boschman enables manufacturers to accelerate time-to-market, reduce operational complexity, and achieve repeatable process quality. This holistic approach positions Boschman not just as an equipment provider, but as a strategic partner in innovation for clients navigating the transition to electrified and digitalized manufacturing ecosystems.

Next Move Strategy Consulting’s View 

According to Next Move Strategy Consulting, the Packaging Market especially in automotive and power electronics is undergoing a fundamental transformation driven by electrification, sustainability mandates, and the miniaturization of semiconductors.

Power module packaging, once a back-end process, has now become a strategic design parameter influencing product performance, reliability, and lifecycle cost. As semiconductor architectures shift toward higher voltage and current densities, silver sintering and advanced molding technologies are emerging as the cornerstone of next-generation assembly.

Boschman’s advancements align closely with these trends. The company’s high-pressure sintering systems and vacuum-assisted FAM solutions provide manufacturers with scalable tools to manage increasing thermal and mechanical demands without compromising yield or reliability. This capability becomes even more critical as global industries pivot toward electric mobility, renewable integration, and smart manufacturing.

Furthermore, the consulting team observes a rising preference for localized, collaborative innovation ecosystems where equipment suppliers, OSATs, and OEMs co-develop packaging processes. Boschman’s partnerships in Taiwan and Europe, as well as its multi-location footprint, position it as a bridge between design innovation and manufacturing execution.

As markets continue to evolve, Next Move Strategy Consulting projects strong growth in advanced power module packaging technologies, with companies like Boschman leading the charge toward a more efficient, electrified, and sustainable future.

Pioneering the Future of Power Electronics

In a world where efficiency and resilience define industrial success, Boschman Technologies stands as a symbol of precision and progress. By continually investing in advanced sintering and molding innovations, the company not only enhances module reliability but also contributes to the broader mission of building smarter, cleaner, and more durable electronic systems.

From its humble beginnings in mold design to its global leadership in sintering systems, Boschman’s journey reflects an unwavering commitment to innovation and collaboration. As demand for high-performance packaging surges worldwide, Boschman is poised to remain at the forefront redefining what’s possible in power module packaging and enabling the next generation of energy-efficient technologies.

Source: Digitimes News
Prepared by: Next Move Strategy Consulting