Pin Fin Heat Sink Market for IGBT by Material (Copper and Aluminum), by Application (Consumer Electronics, Automotive, and Others)- Global Opportunity Analysis and Industry Forecast, 2020 – 2030

Market Definition

The Global Pin Fin Heat Sink Market for IGBT size was valued at USD 0.84 billion in 2019 and is predicted to reach USD 1.47 billion by 2030, with a CAGR of 5.2% from 2020-2030.

Pin fin heat sinks are heat exchangers designed with several pin-like structures, engineered in fin-based geometry, and are fabricated using metals like copper and aluminum. Heat sink’s function is dissipating the heat produced in the operation of electronic or mechanical devices, and maintaining the internal temperature equilibrium. Benefits offered by pin fin heat sink are increased surface area for heat transfer, enhanced operational efficiency, increased longevity, and higher heat transfer coefficient.

Market Dynamics and Trends

The global pin fin heat sink market for IGBT is on a spur, due to the soaring demand for energy efficient, and low-cost thermal management solutions in the IGBT sector. Also, factors such as increasing penetration of AI and robotics technologies, growing demand of consumer electronics, proliferating automotive sector, and the ever-increasing demand for power supply, are expected to supplement the growth of pin fin heat sink market for IGBT throughout the forecast period.

However, low rate of capacity utilization by the manufacturers are expected to restrain the growth of pin fin heat sink market for IGBT. Moreover, increasing inclination towards hybrid pin fins offering higher efficiency and lower operational cost, and untapped market opportunities offered by the emerging economies like India & China, are projected to augment the growth of the global pin fin heat sink market for IGBT, in coming future.

Market Segmentations and Scope of the Study:

The global pin fin heat sink market for IGBT share has been analyzed based on material, application, and geography.

Based on material, the pin fin heat sink market for IGBT market is segmented into copper and aluminum. Based on application, the pin fin heat sink market for IGBT is divided into automotive field, consumer electronics, and others. Geographic breakdown and analysis of each of the previously mentioned segments include regions comprising Europe, North America, Asia-Pacific, and RoW.

Geographical Analysis

North America demonstrates a mature market, and is expected to grow with a substantial market share in the global pin fin heat sink market for IGBT, throughout the forecast period. This is attributed to advancement in technologies, presence of key players, well-established industrial sector, as well as higher demand for efficient thermal management solutions in this region.

Asia Pacific is expected to demonstrate a tremendous growth, growing with the highest CAGR values in the global pin fin heat sink market for IGBT, throughout the forecast period. The market drivers are majorly; higher population ratios in this region, increase in per-capita disposable incomes, and rapid industrialization leading to increased manufacturing of consumer electronics and automotive, specifically in India and China.

Competitive Landscape

The pin fin heat sink market for IGBT, is highly competitive and consists of various market players. Some of the major market players include Apex Microtechnology, Advanced Micro Devices (AMD), Advanced Thermal Solutions Inc., Aavid Thermalloy LLC (A thermal division of Boyd Corporation), CUI Inc., Allbrass Industrial the Brass, Honeywell International Inc., Kunshan Googe Metal Products Co. Ltd., and Comair Rotron, among others. The key players are employing strategies such as product launches, acquisition, and technical collaboration, in-order to gain stronger position in the pin fin heat sink market for IGBT.

For instance, in July 2019, Boyd Corporation, a pioneer in the pin fin heat sink market for IGBT, announced the acquisition over Lytron Inc., a thermal management company specialized in manufacturing liquid coolants. This acquisition aimed at reinforcing Boyd’s monopoly in manufacturing liquid coolants for end-users like Aerospace industry, Healthcare industry, Electronics & Semiconductors, and other industry verticals; along with technology portfolio expansion in the chiller system solutions.

The major giants of thermal management solution providers in the pin fin heat sink market for IGBT, Advanced Thermal Solutions, Inc. (ATS), and Bisco industries, announced a new North American distribution partnership in October 2019, aiming to make available ATS thermal management products to the customers across North America, through the Bisco industry’s distribution network that is spread across 48 distribution channels in the U.S. and Canada.

In November 2019, one of the major players in the pin fin heat sink market for IGBT, Advanced Thermal Solutions Inc., introduced their ‘ultra-cool family’ of high-performance heat sinks, specially designed for cooling high-powered FPGAs, CPUs, GPUs, and AI processors. The heat sink featured an aluminium or copper straight fin base with a powerful blower mounted on its top. The unique fin pattern of the device is ideal for systems with open airflow from front to back. Where aluminium fins reduce the overall weight, copper fins convey heat more efficiently, enhancing the overall thermal performance.

In February 2020, the ruling market player in the pin fin heat sink market for IGBT, Honeywell International Inc., announced its cutting-edge cooling technology to provide thermal management solutions for electronic applications and data centers. Honeywell’s brand new ‘Solstice E-Cooling’ heat transfer agents, cool high-performance electronics and data centres using high-performance servers more efficiently, as compared to traditional cooling methods; offering greater efficiency, lower operational costs, and reduced environmental impact.

KEY BENEFITS

• The pin fin heat sink market for IGBT report provides the quantitative analysis of the current market and estimations through 2020-2030 that assists in identifying the prevailing market opportunities to capitalize on.

• The study comprises a deep dive analysis of the pin fin heat sink market for IGBT trend including the current and future trends for depicting the prevalent investment pockets in the market.

• The report provides detailed information related to key drivers, restraints and opportunities and their impact on the pin fin heat sink market for IGBT.

• The report incorporates competitive analysis of the market players along with their market share in the global pin fin heat sink market for IGBT.

• The SWOT analysis and Porters Five Forces model is elaborated in the study of the pin fin heat sink market for IGBT.

• Value chain analysis in the pin fin heat sink market for IGBT study provides a clear picture of the stakeholders’ roles.

KEY MARKET SEGMENTS:

By Type

• Copper

• Aluminum

By Application

• Atrial Fibrillation

• Atrioventricular Nodal Reentry Tachycardia

• Atrial Flutter

• Wolff-Parkinson-White Syndrome

• Other

By Geography

• North America

  • U.S.

  • Canada

  • Mexico

• Europe

  • UK

  • Germany

  • France

  • Italy

  • Rest of Europe

• Asia-Pacific

  • China

  • India

  • Japan

  • Australia

  • Rest of Asia-Pacific

• RoW

  • UAE

  • Saudi Arabia

  • South Africa

  • Brazil

  • Remaining Countries

REPORT SCOPE AND SEGMENTATION: