Semiconductor Packing Market by Packing Platform (Flip Chip, Embedded Die, Fan-in Wafer Level Packaging (Fi Wlp), and Fan-out Wafer Level Packaging (Fo Wlp)), by End User (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive Industry, and Energy and Lighting)- Global Opportunity Analysis and Industry Forecast, 2020 – 2030

Semiconductor Packing Market

Industry:  Semiconductor & Electronics | Publish Date: Dec 2022 | No of Pages:  N/A | No. Tables:  N/A | No. Figures:  N/A

The Global Semiconductor Packing Market size is estimated to be USD 28.13 billion in 2019 and is predicted to reach USD 63.61 billion by 2030 with a CAGR of 7.7% from 2020-2030. Semiconductor Packing is a case which consists of one or more semiconductors which is made up of plastic, ceramic, glass, metal and others to protect the circuits of semiconductors from external environment and materials. The main aim of the packing is to protect the semiconductors from damage due to various internal and external reasons which may affect the normal functioning of the semiconductors.

Market Dynamics and Trends

There has been technological advancement over the period of time which has helped in the evolution of semiconductors and its uses in different industries. This technological advancement has also fuel the growth of semiconductors on a large scale. Furthermore, increase in the demand of consumer electronics coupled with increase in the demand of smart devices is also expected to fuel the growth of semiconductor packing market over the forecast period.

The other factors include increase in IoT, and artificial intelligence in consumer electronics and smart devices coupled with the increased adoption of advanced semiconductor packing is also expected to accelerate the growth of semiconductor packing market. However, high cost of the advanced packing and availability of substitutes to the conventional packing is expected to inhibit the market growth. Moreover, Increase in research and development coupled with increasing investment by major market players coupled with increased adoption of advanced consumer electronics are further expected to create ample opportunities in the semiconductor packing market in near future.

Market Segmentations and Scope of the Study:

The global semiconductor packing market share is analyzed on the basis of packing platform, end user and geography. On the basis of packing platform, the market is segmented into Flip Chip, Embedded Die, Fan-in Wafer Level Packaging (Fi Wlp), and Fan-out Wafer Level Packaging (Fo Wlp). On the basis of end user, the market is divided into Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive Industry, and Energy and Lighting. Geographic breakdown and analysis of each of the aforesaid segments includes regions comprising North America, Europe, Asia-Pacific, and RoW.

Geographical Analysis

North America is expected to anticipate the major market share due to the increased adoption of advanced technology coupled with increased infrastructure over the forecast period. Furthermore, increased demand of consumer electronics and increased use of smart devices coupled with increased use of IoT and artificial intelligence in consumer electronics is expected to accelerate the growth of semiconductor packing market.

Asia Pacific is expected to show significant growth with gradual increase in market share owing to the increased adoption of smart and advanced devices coupled with increased in disposable income and increased adoption of advanced semiconductor packing materials are expected to gain traction over the forecast period.

 Competitive Landscape

The semiconductor packing market, which is highly competitive, consists of various market players. Some of the major market players include, ASE Group, Fujitsu Ltd, Amkor Technology, Powertech Technology, Inc., Jcet/Stats Chippac Ltd, Chipbond Technology Corporation, UTAC Group, Samsung Electronics Co. Ltd, Tianshui Huatian Technology Co. Ltd, Intel Corporation, Unisem (M) Berhad, Carsem, Chipmos Technologies, Inc., Siliconware Precision Industries Co. Ltd (Spil) and Interconnect Systems, Inc. (ISI) among others.

There have been various developments taken place in the past and will also takes place in the future which is expected further accelerate the market growth over the forecast period. For instance, in July 2019, Amkor Technology, Inc., a leading provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology. Amkor’s cutting-edge AiP technology has already been deployed into modules designed for smartphones and other mobile devices.


KEY BENEFITS

  • The semiconductor packing market report provides the quantitative analysis of the current market and estimations through 2020-2030 that assists in identifying the prevailing market opportunities to capitalize on.
  • The study comprises a deep dive analysis of the semiconductor packing market trend including the current and future trends for depicting the prevalent investment pockets in the market.
  • The information related to key drivers, restraints and opportunities and their impact on the semiconductor packing market is provided in the report.
  • The competitive analysis of the market players along with their market share in the global semiconductor packing market.
  • The SWOT analysis and Porters Five Forces model is elaborated in the study.
  • Value chain analysis in the market study provides a clear picture of the stakeholders’ roles.

KEY MARKET SEGMENTS:

  • Global Semiconductor Packing market – By Packing Platform
    • Flip Chip
    • Embedded Die
    • Fan-in Wafer Level Packaging (Fi Wlp)
    • Fan-out Wafer Level Packaging (Fo Wlp)
  • Global Semiconductor Packing market – By End User
    • Consumer Electronics
    • Aerospace and Defense
    • Medical Devices
    • Communications and Telecom
    • Automotive Industry
    • Energy and Lighting
  • Global Semiconductor Packing market –By Geography
    • North America
      • U.S.
      • Canada
      • Mexico
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Rest of Europe
    • Asia-Pacific
      • China
      • India
      • Japan
      • Australia
      • Rest of Asia-Pacific
    • RoW
      • UAE
      • Saudi Arabia
      • South Africa
      • Brazil
      • Rest of RoW

KEY BENEFITS

  • The semiconductor packing market report provides the quantitative analysis of the current market and estimations through 2020-2030 that assists in identifying the prevailing market opportunities to capitalize on.
  • The study comprises a deep dive analysis of the semiconductor packing market trend including the current and future trends for depicting the prevalent investment pockets in the market.
  • The information related to key drivers, restraints and opportunities and their impact on the semiconductor packing market is provided in the report.
  • The competitive analysis of the market players along with their market share in the global semiconductor packing market.
  • The SWOT analysis and Porters Five Forces model is elaborated in the study.
  • Value chain analysis in the market study provides a clear picture of the stakeholders’ roles.

KEY MARKET SEGMENTS:

  • Global Semiconductor Packing market – By Packing Platform
    • Flip Chip
    • Embedded Die
    • Fan-in Wafer Level Packaging (Fi Wlp)
    • Fan-out Wafer Level Packaging (Fo Wlp)
  • Global Semiconductor Packing market – By End User
    • Consumer Electronics
    • Aerospace and Defense
    • Medical Devices
    • Communications and Telecom
    • Automotive Industry
    • Energy and Lighting
  • Global Semiconductor Packing market –By Geography
    • North America
      • U.S.
      • Canada
      • Mexico
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Rest of Europe
    • Asia-Pacific
      • China
      • India
      • Japan
      • Australia
      • Rest of Asia-Pacific
    • RoW
      • UAE
      • Saudi Arabia
      • South Africa
      • Brazil
      • Rest of RoW

KEY PLAYERS:

  • ASE Group
  • Fujitsu Ltd
  • Amkor Technology
  • Powertech Technology, Inc.
  • Jcet/Stats Chippac Ltd
  • Chipbond Technology Corporation
  • UTAC Group
  • Samsung Electronics Co. Ltd
  • Tianshui Huatian Technology Co. Ltd
  • Intel Corporation
  • Unisem (M) Berhad
  • Carsem
  • Chipmos Technologies, Inc.
  • Siliconware Precision Industries Co. Ltd (Spil)
  • Interconnect Systems, Inc. (ISI)